Backlight assembly having light emitting diode package and display apparatus having the same

ABSTRACT

A backlight assembly includes a first light emitting unit having a first light emitting diode, a second light emitting unit having a second light emitting diode, a third heat conduction member, and a receiving container accommodating the first light emitting unit and the second light emitting unit. The first light emitting unit includes a first heat conduction member connected to the first light emitting diode to absorb a heat from the first light emitting diode, and the second light emitting unit includes a second heat conduction member connected to the second light emitting diode to absorb a heat from the second light emitting diode. A third heat conduction member is connected to the first and second heat conduction members to discharge the heats from the first and second light emitting diodes.

CROSS-REFERENCE TO RELATED APPLICATION

This application relies for priority upon Korean Patent Application No.2010-94622 filed on Sep. 29, 2010, the contents of which are hereinincorporated by reference in its entirety.

BACKGROUND

1. Field of Disclosure

The subject matter described relates to a backlight assembly having alight emitting diode package and a display apparatus having thebacklight assembly as a light source thereof. More particularly, thesubject matter relates to a backlight assembly capable of preventingvariation of color coordinate of a light and a display apparatus havingthe backlight assembly.

2. Description of the Related Art

In general, a light emitting diode package includes a plurality of lightemitting diodes emitting different color lights mixed together to emit awhite light. However, as the emitting time of each light emitting diodeincreases the heat generated by the diode also increases so that theintensity of the light emitted from each light emitting diode becomesweaker, and the color coordinate of the white light varies in the lightemitting diode package.

SUMMARY

Although various embodiments are described herein, in accordance to oneexemplary embodiment, a backlight assembly may include a first lightemitting unit, a second light emitting unit, a third heat conductionmember, and a receiving container receiving the first and second lightemitting units.

The first light emitting unit may include a first light emitting diodeand a first heat conduction member that is electrically connected to thefirst light emitting diode to absorb heat generated from the first lightemitting diode. The second light emitting unit may include a secondlight emitting diode and a second heat conduction member that iselectrically connected to the second light emitting diode to absorb heatgenerated from the second light emitting diode. In addition, the thirdheat conduction member may be connected to the first heat conductionmember and the second heat conduction member to discharge the heatgenerated from the first and second heat conduction members.

According to the above, the heat generated from the first light emittingdiode and absorbed by the first heat conduction member and the heatgenerated from the second light emitting diode and absorbed by thesecond heat conduction member may be maintained in a thermal equilibriumstate by the third heat conduction member and easily discharged to theexterior. Thus, although the light emitting time increases, the lightintensity variation of the first and second diodes, which is caused bythe heat, may be prevented. In addition, the decrease in the amount ofthe light intensity variation of the first light emitting diode may beequal to the decrease in the amount of the light intensity variation ofthe second light emitting diode, so that the change of the colorcoordinate of the light emitted from the light emitting diode packagemay be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter described herein will become readily apparent byreference to the following detailed description when considered inconjunction with the accompanying drawings wherein:

FIG. 1 is a perspective view showing a light emitting diode packageaccording to an exemplary embodiment;

FIG. 2 is a cross-sectional view taken along a line I-I′ of FIG. 1;

FIG. 3 is a cross-sectional view a light emitting diode packageaccording to another exemplary embodiment;

FIG. 4 is a perspective view showing a light emitting diode packageaccording to another exemplary embodiment;

FIG. 5 is a cross-sectional view taken along a line II-II′ of FIG. 4;

FIG. 6 is a cross-sectional view showing a light emitting diode packageaccording to another exemplary embodiment;

FIG. 7 is a cross-sectional view showing a light emitting diode packageaccording to another exemplary embodiment;

FIG. 8 is a graph showing a light intensity variation according to alight emitting time of each of first and second light emitting unitsshown in FIG. 1; and

FIG. 9 is an exploded perspective view showing a display apparatusaccording to another exemplary embodiment.

DETAILED DESCRIPTION

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms, “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “includes”and/or “including”, when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Hereinafter, the subject matter will be explained in detail withreference to the accompanying drawings.

FIG. 1 is a perspective view showing a light emitting diode packageaccording to an exemplary embodiment, and FIG. 2 is a cross-sectionalview taken along a line I-I′ of FIG. 1.

Referring to FIGS. 1 and 2, a light emitting diode package 400 includesa first light emitting unit 100, a second light emitting unit 200, and acircuit substrate 300. In the present exemplary embodiment, the lightemitting diode package 400 may emit a white light by mixing a lightemitted from the first light emitting unit 100 with a light emitted fromthe second light emitting unit 200.

The first light emitting unit 100 includes a first mold 110, a firstlight emitting diode 120, a first terminal 130, a second terminal 135, afirst heat conduction member 132, a first wire W1, a second wire W2, afirst protective layer 128, and a fluorescent substance 125.

The first mold 110 includes a receiving space therein and its upperportion is opened. The first light emitting diode 120 is received in thereceiving space and receives a power source voltage from the circuitsubstrate 300 to emit a light. In the present exemplary embodiment, thefirst light emitting diode 120 may be an InGaN-based compoundsemiconductor chip, a GaN-based compound semiconductor chip, or anAlGaN-based compound semiconductor chip.

The first protective layer 128 fills the receiving space to cover thefirst light emitting diode 120. The first protective layer 128 mayinclude an epoxy resin or a silicon resin having a superior lighttransmittance. The fluorescent substance 125 receives a part of a bluelight emitted from the first light emitting diode 120 and converts thepart of the blue light into a light having a wavelength different fromthat of the blue light. As an example, the fluorescent substance 125 mayconvert the blue light into a red light. In addition, the fluorescentsubstance 125 may be formed in particles and distributed in the firstprotective layer 128.

The first terminal 130 includes a first end accommodated in the firstmold 110 and a second end withdrawn outside the first mold 110. Similarto the first terminal 130, the second terminal 135 includes a first endaccommodated in the first mold 110 and a second end withdrawn outsidethe first mold 110.

The first wire W1 electrically connects a positive electrode (not shown)of the first light emitting diode 120 to the first terminal 130 and thesecond wire W2 electrically connects a negative electrode (not shown) ofthe first light emitting diode 120 to the second terminal 135.

The first heat conduction member 132 is surrounded by the first mold 110and positioned under the first light emitting diode 120. The first heatconduction member 132 absorbs the heat generated from the first lightemitting diode 120. In the present exemplary embodiment, the first heatconduction member 132 may include a metal material having superior heatconductivity such as a copper, and the first heat conduction member 132may directly make contact with the first light emitting diode 120.

The second light emitting unit 200 includes a second mold 210, a secondlight emitting diode 220, a third terminal 230, a fourth terminal 235, asecond heat conduction member 232, a third wire W3, a fourth wire W4,and a protective layer 228.

The second mold 210 includes a receiving space therein and its upperportion is opened. The second light emitting diode 220 is accommodatedin the receiving space and receives a power source voltage from thecircuit substrate 300 to emit a light. The receiving space of the secondmold 210 is filled with the second protective layer 228 and the secondlight emitting diode 220 is covered by the second protective layer 228.

The third terminal 230 includes a first end accommodated in the secondmold 210 and a second end withdrawn outside the second mold 210. Thethird terminal 230 faces the second terminal 135 in an area between thefirst terminal 130 and the forth terminal 235. In addition, the fourthterminal 235 includes a first end accommodated in the second mold 210and a second end withdrawn outside the second mold 210.

The third wire W3 electrically connects a positive electrode (not shown)of the second light emitting diode 220 to the third terminal 230 and thefourth wire W4 electrically connects a negative electrode (not shown) ofthe second light emitting diode 220 to the fourth terminal 235.

The second heat conduction member 232 is surrounded by the second mold210 and positioned under the second light emitting diode 220. Inaddition, the second heat conduction member 232 absorbs the heatgenerated from the second light emitting diode 220. In the presentexemplary embodiment, the second heat conduction member 232 may includea metal material having superior heat conductivity such as a copper, andthe second heat conduction member 232 may directly make contact with thefirst light emitting diode 220.

Meanwhile, in the present exemplary embodiment, the first light emittingdiode 120 emits the blue light, the second light emitting diode 220emits a green light, and the fluorescent substance 125 receives the bluelight and converts the blue light into the red light. Accordingly, thelight emitting diode package 400 may emit the white light into which theblue light, the red light, and the green light are mixed.

The circuit substrate 300 includes an insulation part 305, a firstconductive pattern 310, a second conductive pattern 320, and a thirdconductive pattern 330, which are disposed on the insulation part 305,to supply the power source voltage to the first light emitting unit 100and the second light emitting unit 200.

The first conductive pattern 310 is electrically connected to the firstterminal 130, the second conductive pattern 320 is electricallyconnected to the second and third terminals 135 and 230, and the thirdconductive pattern 330 is electrically connected to the fourth terminal235. Although not shown in FIGS. 1 and 2, each of the first and thirdconductive patterns 310 and 330 is electrically connected to a powersupply part (not shown) disposed on the circuit substrate 300 andreceives the power source voltage from the power supply part.

In addition, a third heat conduction member 340 is disposed on theinsulation part 305 and spaced apart from the first, second, and thirdconductive patterns 310, 320, and 330. The third heat conduction member340 may include a material having superior heat conductivity such ascopper. The third heat conduction member 340 includes a first connectionportion 344 connected with the first heat conduction member 132, asecond connection portion 345 connected with the second heat conductionmember 232, and a third connection portion 348 connected between thefirst connection portion 344 and the second connection portion 348.

The first heat conduction member 132 absorbs the heat emitted from thefirst light emitting diode 120, and thus the first heat conductionmember 132 has a first heat at a first temperature. The second heatconduction member 232 absorbs the heat emitted from the second lightemitting diode 220, so the second heat conduction member 232 has asecond heat at a second temperature. On the assumption that the thirdheat conduction member 340 has a temperature lower than the first andsecond temperatures, the first and second heats respectively transmittedto the first and second heat conduction members 132 and 232 may betransmitted to the third heat conduction member 340. As a result, theheat transmitted to the third heat conduction member 340 may be easilydischarged to the exterior.

Thus, the first and second temperatures of the heat transmitted to thefirst and second heat conduction members 132 and 232 may be reduced, andthe temperature difference between the first and second temperatures maybe reduced.

Each of the first and second light emitting diodes 120 and 220 has astructure in which a p-type semiconductor and an n-type semiconductorare stacked, and the first and second temperatures may be associatedwith the heat generated at the p-n junction portion between the p-typesemiconductor and the n-type semiconductor. However, as the temperatureof the p-n junction portion increases, the intensity of the lightemitted from the first and second light emitting diodes 120 and 220 maybe reduced. Thus, as described above, as the light emitting timeincreases the first and second temperatures are lowered by the thirdheat conduction member 340 to prevent the light intensity of the lightemitting diodes 120 and 220 from being reduced.

In addition, the first and second temperatures may reach a thermalequilibrium state by the third heat conduction member 340. The thermalequilibrium state related to the first and second temperatures will bedescribed with reference to FIG. 8.

FIG. 8 is a graph showing a light intensity variation according to alight emitting time of each of first and second light emitting unitsshown in FIG. 1.

Referring to FIGS. 1, 2, and 8, a first graph G1 shows the lightintensity variation according to the light emitting time of the firstlight emitting diode 120 and a second graph G2 show the light intensityvariation according to the light emitting time of the second lightemitting diode 220.

In addition, a third graph G3 and a fourth graph G4 shows the lightintensity variation according to the light emitting time of the lightemitting diode package 400 that does not include the third heatconduction member 340. Particularly, the third graph G3 shows the lightintensity variation according to the light emitting time of the firstlight emitting diode 120 and the fourth graph G4 shows the lightintensity variation according to the light emitting time of the secondlight emitting diode 220.

Referring to the first and third graphs G1 and G3, since the heatgenerated from the first light emitting diode 120 may be easilydischarged to the exterior, the light intensity variation of the firstlight emitting diode 120 according to the increase of the light emittingtime is relatively smaller than when the light emitting diode package400 does not include the third heat conduction member 340. In addition,referring to the second and fourth graphs G2 and G4, the light intensityvariation of the second light emitting diode 220 according to theincrease of the light emitting time is relatively smaller than when thelight emitting diode package 400 does not include the third heatconduction member 340. Accordingly, the light emitting intensity of thefirst and second light emitting diodes 120 and 220 may be increased bythe third heat conduction member 340.

Referring to the first and second graphs G1 and G2 again, when thedifference between the light intensity of the first light emitting diode120 and the light intensity of the second light emitting diode 220 atthe first timing at which the first and second light emitting diodes 120and 220 start to emit the light is referred to as a first lightintensity A1 and the difference between the light intensity of the firstlight emitting diode 120 and the light intensity of the second lightemitting diode 220 at the timing after the lapse of the light emittingtime of about “t” is referred to as a second light intensity A2, thefirst light intensity A1 may be substantially equal to the second lightintensity A2. This is because the heat generated from the first lightemitting diode 120 and the heat generated from the second light emittingdiode 220 may be maintained in the thermal equilibrium state by thethird heat conduction member 340 that connects the first heat conductionmember 132 and the second heat conduction member 232. As a result, thedecrease in the amount of the light intensity variation of the firstlight emitting diode 120 according to the light emitting time of thefirst light emitting diode 120 may be the same the decrease in theamount of the light intensity variation of the second light emittingdiode 220 according to the light emitting time of the second lightemitting diode 220.

As described above, in the case that the decrease in the amount of thelight intensity variation of the first light emitting diode 120according to the light emitting time of the first and second lightemitting diodes 120 and 220 is equal to the decrease in the amount ofthe light intensity variation of the second light emitting diode 220according to the light emitting time of the first and second lightemitting diodes 120 and 220, the light emitted from the first lightemitting unit 100 and the light emitted from the second light emittingunit 200 may be uniformly mixed with each other. Accordingly, the changeof the color coordinate of the light emitted from the light emittingdiode package 400 may be prevented.

Meanwhile, referring to the third and fourth graphs G3 and G4 again,when the difference between the light intensity of the first lightemitting diode 120 and the light intensity of the second light emittingdiode 220 at the first timing at which the first and second lightemitting diodes 120 and 220 start to emit the light is referred to asthe first light intensity A1 and the difference between the lightintensity of the first light emitting diode 120 and the light intensityof the second light emitting diode 220 at the timing after the lapse ofthe light emitting time of about “t” is referred to as a third lightintensity A3, the difference between the first light intensity A1 andthe third light intensity A3 exists. The reason is as follows.

In the case that the light emitting diode package 400 does not includethe third heat conduction member 340, the heat generated from the firstlight emitting diode 120 and the heat generated from the second lightemitting diode 220 are not interchanged with each other. Accordingly,the decrease in the amount of the light intensity variation of the firstlight emitting diode 120 according to the light emitting time of thefirst light emitting diode 120 may be different from the decrease in theamount of the light intensity variation of the second light emittingdiode 220 according to the light emitting time of the second lightemitting diode 220.

This is because a current amount applied to the first light emittingdiode 120 is different from a current amount applied to the second lightemitting diode 220. In general, a light-emitting efficiency of a lightemitting diode that emits a blue light may be lower than alight-emitting efficiency of a light emitting diode that emits a greenlight. Thus, the current amount applied to the first light emittingdiode 120 may be larger than the current amount applied to the secondlight emitting diode 220, so that the temperature of the p-n junctionportion in the first light emitting diode 120 may be higher than thetemperature of the p-n junction portion in the second light emittingdiode 220. As a result, the decrease in the amount of the lightintensity variation of the first light emitting diode 120 according tothe light emitting time of the first light emitting diode 120 may belarger than the decrease in the amount of the light intensity variationof the second light emitting diode 220 according to the light emittingtime of the second light emitting diode 220.

As described with reference to FIGS. 1, 2, and 8, however, since theheat generated from the first light emitting diode 120 and the heatgenerated from the second light emitting diode 220 may be maintained inthe thermal equilibrium state by the third heat conduction member 340,and the third heat conduction member 340 discharges the heat to theexterior, the change of the color coordinate of the light emitted fromthe light emitting diode package 400 may be prevented.

FIG. 3 is a cross-sectional view a light emitting diode packageaccording to another exemplary embodiment. In the present exemplaryembodiment, a light emitting diode package 401 shown in FIG. 3 includesa circuit substrate 301 having a structure different from that of thecircuit substrate 300 shown in FIGS. 1 and 2. Accordingly, the circuitsubstrate 301 will be mainly described with reference to FIG. 3, andother elements in FIG. 3 will be assigned the same reference numerals inFIGS. 1 and 2. In addition, detailed descriptions of the same elementswill be omitted.

Referring to FIG. 3, the light emitting diode package 401 includes afirst light emitting unit 100, a second light emitting unit 200, and acircuit substrate 301.

The circuit substrate 301 includes an insulation part 305, a firstconductive pattern 310, a second conductive pattern 320, a thirdconductive pattern 330, and a third heat conductive member 343. Theinsulation part 305 is provided with a first via hole VH1 and a secondvia hole VH2 formed therethrough, and the first and second via holes VH1and VH2 are positioned at positions corresponding to the first heatconductive member 132 and the second heat conductive member 232,respectively.

The third heat conductive member 343 includes a first connection portion341A, a second connection portion 341B, and a third connection portion342. The first connection portion 341A is accommodated in the first viahole VH1 and makes contact with the first heat conductive member 132,and the second connection portion 341B is accommodated in the second viahole VH2 and makes contact with the second heat conductive member 232.In addition, the third connection portion 342 is connected to the firstconnection portion 341A and the second connection portion 341B anddisposed on a rear surface of the insulation part 305. According to thethird heat conductive member 343, the heats generated from the first andsecond heat conductive members 132 and 232 are transmitted to the thirdheat conductive member 343 through the first and second connectionportions 341A and 341B and discharged to the exterior through the thirdheat conductive member 343. Further, since the third heat conductivemember 343 is disposed on the rear surface of the insulation part 305,the circuit substrate 305 may be reduced in size.

Meanwhile, in the present exemplary embodiment with reference to FIG. 3,the first heat conductive member 132 and the second heat conductivemember 232 make contact with the third heat conductive member 342.However, the first heat conductive member 132, the second heatconductive member 232, and the third heat conductive member 343 may beintegrally formed with each other.

FIG. 4 is a perspective view showing a light emitting diode packageaccording to another exemplary embodiment, and FIG. 5 is across-sectional view taken along a line II-II′ of FIG. 4. In FIGS. 4 and5, the same reference numerals denote the same elements in FIGS. 1 and2, and thus detailed descriptions of the same elements will be omitted.

Referring to FIGS. 4 and 5, a light emitting diode package 402 includesa first light emitting unit 101, a second light emitting unit 202, and acircuit substrate 302.

The first light emitting unit 101 includes a first mold 110, a firstlight emitting diode 120, a first terminal 131, a second terminal 136, afirst wire W1, a second wire W2, a first protective layer 128, and afluorescent substance 125.

The first terminal 131 includes a first end spaced apart from the firstlight emitting diode 120 and accommodated in the first mold 110 and asecond end withdrawn outside the first mold 110 and electricallyconnected to the first conductive pattern 310. In addition, the secondterminal 136 includes a first end accommodated in the first mold 110 anddisposed under the first light emitting diode 120 and a second endwithdrawn outside the first mold 110 and electrically connected to thesecond conductive pattern 320.

The first wire W1 electrically connects the positive electrode of thefirst light emitting diode 120 to the first terminal 131 and the secondwire W2 electrically connects the negative electrode of the first lightemitting diode 120 to the second terminal 136.

According to the present exemplary embodiment shown in FIGS. 4 and 5,the second terminal 136 makes direct contact with the first lightemitting diode 120 and absorbs the heat generated from the first lightemitting diode 120. To this end, the second terminal 136 has a lengthlonger than that of the first terminal 131.

The second light emitting unit 201 includes a second mold 210, a secondlight emitting diode 220, a third terminal 231, a fourth terminal 236, athird wire W3, and a fourth wire W4.

The third terminal 231 includes a first end accommodated in the secondmold 210 and disposed under the second light emitting diode 220 and asecond end withdrawn outside the second mold 210 and electricallyconnected to the second conductive pattern 320. In addition, the fourthterminal 236 includes a first end spaced apart from the second lightemitting diode 220 and accommodated in the second mold 210 and a secondend withdrawn outside the second mold 210 and electrically connected tothe third conductive pattern 330.

The third wire W3 electrically connects the positive electrode of thesecond light emitting diode 220 to the third terminal 231 and the fourthwire W4 electrically connects the negative electrode of the second lightemitting diode 220 to the fourth terminal 236.

Thus, the third terminal 231 makes directly contact with the secondlight emitting diode 220 and absorbs the heat generated from the secondlight emitting diode 220. To this end, the third terminal 231 has alength longer than that of the fourth terminal 236.

According to the first and second light emitting units 101 and 201, thesecond and third terminals 136 and 231 make directly contact with thefirst and second light emitting diodes 120 and 220, respectively, andthe second and third terminals 136 and 231 are connected with the secondconductive pattern 320. Thus, the second terminal 136 may absorb theheat generated from the first light emitting diode 120 instead of thefirst heat conduction member 132 shown in FIG. 2 and the third terminal231 may absorb the heat generated from the second light emitting diode220 instead of the second heat conduction member 232 shown in FIG. 2. Inaddition, the heat generated from the first and second light emittingdiodes 120 and 220 may be maintained in the thermal equilibrium state bythe second conductive pattern 320 instead of the third heat conductionmember 340 shown in FIG. 2, and the heat may be discharged to theexterior through the second conductive pattern.

Meanwhile, the second terminal 136 and the third terminal 231 makecontact with the second conductive pattern 320 according to the presentexemplary embodiment in FIGS. 4 and 5. However, the second terminal 136,the third terminal 231, and the second conductive pattern 320 may beintegrally formed with each other, or the second terminal 136 and thethird terminal 231 may be integrally formed with each other afterremoving the second conductive pattern 320.

FIG. 6 is a cross-sectional view showing a light emitting diode packageaccording to another exemplary embodiment. In the present exemplaryembodiment, a light emitting diode package 403 shown in FIG. 6 furtherincludes a barrier 380 compared to the light emitting diode package 400shown in FIGS. 1 and 2. Accordingly, the barrier 380 will be mainlydescribed with reference to FIG. 6, and other elements in FIG. 6 will beassigned the same reference numerals in FIGS. 1 and 2. In addition,detailed descriptions of the same elements will be omitted.

Referring to FIG. 6, the light emitting diode package 403 includes thefirst light emitting unit 100, the second light emitting unit 200, thecircuit substrate 300, and the barrier 380.

The barrier 380 is disposed between the first mold 110 and the secondmold 210. In the present exemplary embodiment, the barrier 380 mayinclude a polymer material such as polyphthalamide (PPA) and block thelight emitted from the second light emitting unit 200 and traveling tothe fluorescent substance 125.

Therefore, the light emitted from the second light emitting unit 200 maybe prevented from being absorbed or scattered by the fluorescentsubstance 125. Consequently, the light emitted from the first lightemitting unit 100 and the light emitted from the second light emittingunit 200 may be uniformly mixed with each other. Accordingly, the changeof the color coordinate of the light emitted from the light emittingdiode package 403 may be prevented.

FIG. 7 is a cross-sectional view showing a light emitting diode packageaccording to another exemplary embodiment. In the present exemplaryembodiment, a light emitting diode package 404 further includes abarrier 380 having the substantially same structure as theabove-mentioned barrier 380 with reference to FIG. 6 and a fluorescentlayer 126 instead of the fluorescent substance 125 shown in FIG. 1compared to the light emitting diode package 400 shown in FIGS. 1 and 2.Thus, in FIG. 7, the same reference numerals denote the same elements inFIGS. 1, 2, and 6, and thus detailed description of the same elementswill be omitted.

Referring to FIG. 7, the light emitting diode package 404 includes afirst light emitting unit 102, a second light emitting unit 200, acircuit substrate 300, a barrier 380, and a fluorescent layer 126.

Different from the fluorescent substance 125 described with reference toFIGS. 1 and 2, the fluorescent layer 126 receives a part of a blue lightemitted from the first light emitting diode 120 and converts the part ofthe blue light into a light having a wavelength different from that ofthe blue light.

As described above, in the case that the fluorescent layer 126 isdisposed on the first light emitting diode 120, the amount of the lightgenerated by the second light emitting unit 200 and absorbed orscattered by the fluorescent substance 125 (shown in FIG. 1) distributedin the first protective layer 128 may be reduced lower than the amountof the light absorbed or scattered by the fluorescent layer 126.Accordingly, the light emitted from the first light emitting unit 100and the light emitted from the second light emitting unit 200 may beuniformly mixed with each other. Accordingly, the change of the colorcoordinate of the light emitted from the light emitting diode package404 may be prevented.

FIG. 9 is an exploded perspective view showing a display apparatusaccording to another exemplary embodiment.

Referring to FIG. 9, a display apparatus 1000 includes a backlightassembly 800 that generates a light and a display panel 900 thatreceives the light to display an image.

The backlight assembly 800 includes a light emitting diode package 400described with reference to FIGS. 1 and 2, a receiving container 500that receives the light emitting diode package 400, a diffusion plate600, and optical sheets 700.

Since the light emitting diode package 400 has the structure same asthat of the light emitting diode package 400 described with reference toFIGS. 1 and 2, the detailed description of the light emitting diodepackage 400 will be omitted. Meanwhile, the light emitting diode package400 is provided in plural on the circuit substrate 300.

The receiving container 500 includes a bottom and sidewalls extendedfrom the bottom to provide the receiving space in which the circuitsubstrate 300 on which the light emitting diode package 400 is mountedis received. In addition, the receiving container 500 is coupled with acover member 950 to firmly receive the light emitting diode package 400.

The diffusion plate 600 is disposed on the light emitting diode package400 to diffuse the light generated by the light emitting diode package400. The optical sheets 700 are disposed on the diffusion plate 600. Inthe present exemplary embodiment, the optical sheets 700 may include aprism film that condenses the light exiting from the diffusion plate 600to improve front brightness and a diffusion film that diffuses the lightexiting from the prism film.

The display panel 900 includes a first substrate 910 and a secondsubstrate 920 facing the first substrate 910. The first substrate 910includes a plurality of pixels (not shown), and each pixel may include athin film transistor and a pixel electrode (not shown) electricallyconnected to the thin film transistor.

In addition, the second substrate 920 may include color filters (notshown) positioned at positions corresponding to the pixels,respectively. Further, in the case that the display panel 900 is for aliquid crystal display, the second substrate 920 may include a commonelectrode (not shown) that forms an electric field with the pixelelectrodes.

Although the exemplary embodiments have been described, it is understoodthe subject matter described herein should not be limited to theseexemplary embodiments but various changes and modifications can be madeby one ordinary skilled in the art within the intended spirit and scopehereinafter claimed.

What is claimed is:
 1. A backlight assembly comprising: a first lightemitting unit comprising a first light emitting diode, a first terminalelectrically connected to a positive electrode of the first lightemitting diode, a second terminal electrically connected to a negativeelectrode of the first light emitting diode, and a first heat conductionmember, the first heat conduction member coupled to a thermallyconductive area of the first light emitting diode to absorb a heatgenerated from the first light emitting diode; a second light emittingunit comprising a second light emitting diode, a third terminalelectrically connected to a positive electrode of the second lightemitting diode, a fourth terminal electrically connected to a negativeelectrode of the second light emitting diode, and a second heatconduction member, the second heat conduction member coupled to athermally conductive area of the second light emitting diode to absorb aheat generated from the second light emitting diode; a third heatconduction member connected to the first heat conduction member and thesecond heat conduction member; and a receiving container receiving thefirst light emitting unit and the second light emitting unit.
 2. Thebacklight assembly of claim 1, further comprising a circuit substrateelectrically connected to the first light emitting unit and the secondlight emitting unit to supply a power source voltage to the first lightemitting unit and the second light emitting unit, wherein the circuitsubstrate comprises: an insulation part; a first conductive patterndisposed on the insulation part and electrically connected to the firstterminal; a second conductive pattern disposed on the insulation partand electrically connected to the second terminal and the thirdterminal; and a third conductive pattern disposed on the insulation partand electrically connected to the fourth terminal.
 3. The backlightassembly of claim 2, wherein the heat conduction member is disposed onthe insulation part and spaced apart from the first conductive pattern,the second conductive pattern, and the third conductive pattern.
 4. Thebacklight assembly of claim 2, wherein the heat conduction member passesthrough the insulation part and extended to a rear surface of theinsulation part and is positioned on a surface of the insulation part,which is different from the first conductive pattern, the secondconductive pattern, and the third conductive pattern.
 5. The backlightassembly of claim 1, wherein the first light emitting unit furthercomprises: a first mold receiving the first light emitting diode; afirst protective layer accommodated in the first mold to cover the firstlight emitting diode; and a fluorescent substance accommodated in thefirst mold to change a wavelength of a light provided from the firstlight emitting diode, and the second light emitting unit furthercomprises: a second mold receiving the second light emitting diode; anda second protective layer accommodated in the second mold to cover thesecond light emitting diode.
 6. The backlight assembly of claim 5,further comprising a barrier disposed between the first mold and thesecond mold to block the light generated by the second light emittingdiode and traveling to the fluorescent substance.
 7. The backlightassembly of claim 5, wherein the fluorescent substance is distributed inthe first protective layer.
 8. The backlight assembly of claim 5,wherein the fluorescent substance is spaced apart from the firstprotective layer and disposed between the first protective layer and thefirst light emitting diode.
 9. The backlight assembly of claim 5,wherein the first light emitting diode emits a blue light, the secondlight emitting diode emits a green light, and the fluorescent substancereceives the blue light to convert the blue light to a red light. 10.The backlight assembly of claim 1, wherein the first heat conductionmember, the second heat conduction member, and the third heat conductionmember are integrally formed with each other.
 11. A backlight assemblycomprising: a first light emitting unit comprising a first lightemitting diode, a first terminal electrically connected to a positiveelectrode of the first light emitting diode, and a second terminalelectrically connected to a negative electrode of the first lightemitting diode; a second light emitting unit comprising a second lightemitting diode, a third terminal electrically connected to a positiveelectrode of the second light emitting diode, and a fourth terminalelectrically connected to a negative electrode of the second lightemitting diode; a receiving container receiving the first light emittingunit and the second light emitting unit; and a circuit substrateelectrically connected to the first light emitting unit and the secondlight emitting unit to supply a power source voltage to the first lightemitting unit and the second light emitting unit; wherein the secondterminal makes contact with the first light emitting diode, the thirdterminal makes contact with the second light emitting diode, and thesecond terminal faces the third terminal in an area between the firstterminal and the forth terminal, wherein the circuit substratecomprises: an insulation part; a first conductive pattern disposed onthe insulation part and electrically connected to the first terminal; asecond conductive pattern disposed on the insulation part andelectrically connected to the second terminal and the third terminal;and a third conductive pattern disposed on the insulation part andelectrically connected to the fourth terminal.
 12. The backlightassembly of claim 11, wherein the first light emitting unit furthercomprises: a first mold receiving the first light emitting diode; afirst protective layer accommodated in the first mold to cover the firstlight emitting diode; and a fluorescent substance accommodated in thefirst mold to change a wavelength of a light provided from the firstlight emitting diode, and the second light emitting unit furthercomprises: a second mold receiving the second light emitting diode; anda second protective layer accommodated in the second mold to cover thesecond light emitting diode.
 13. The backlight assembly of claim 12,further comprising a barrier disposed between the first mold and thesecond mold to block the light generated by the second light emittingdiode and traveling to the fluorescent substance.
 14. The backlightassembly of claim 12, wherein the fluorescent substance is distributedin the first protective layer.
 15. The backlight assembly of claim 12,wherein the fluorescent substance is spaced apart from the firstprotective layer and positioned between the first protective layer andthe first light emitting diode.
 16. The backlight assembly of claim 12,wherein the first light emitting diode emits a blue light, the secondlight emitting diode emits a green light, and the fluorescent substancereceives the blue light to convert the blue light to a red light. 17.The backlight assembly of claim 11, wherein the first light emittingunit further comprises: a first wire that electrically connects apositive electrode of the first light emitting diode to the firstterminal; and a second wire that electrically connects a negativeelectrode of the first light emitting diode to the second terminal, andthe second light emitting unit further comprises: a third wire thatelectrically connects a positive electrode to the third terminal; and afourth wire that electrically connects a negative electrode to thefourth terminal.
 18. The backlight assembly of claim 11, wherein thesecond terminal and the third terminal are integrally formed with eachother.
 19. A light emitting diode package comprising: a first lightemitting unit comprising a first light emitting diode having first andsecond electrodes and a thermally conductive area the first lightemitting unit further comprising a first heat conduction member, thefirst heat conduction member coupled to the thermally conductive area ofthe first light emitting diode to absorb a heat generated from the firstlight emitting diode; a second light emitting unit comprising a secondlight emitting diode having first and second electrodes and a thermallyconductive area, the second light emitting unit further comprising asecond heat conduction member, the second heat conduction member coupledto the thermally conductive area of the second light emitting diode toabsorb a heat generated from the second light emitting diode; and athird heat conduction member connected to the first heat conductionmember and the second heat conduction member.
 20. A display apparatuscomprising: a backlight assembly generating a light; and a display panelreceiving the light to display an image, wherein the backlight assemblycomprises: a first light emitting unit comprising a first light emittingdiode, a first terminal electrically connected to a positive electrodeof the first light emitting diode, and a second terminal electricallyconnected to a negative electrode of the first light emitting diode; asecond light emitting unit comprising a second light emitting diode, athird terminal electrically connected to a positive electrode of thesecond light emitting diode, and a fourth terminal electricallyconnected to a negative electrode of the second light emitting diode; areceiving container receiving the first light emitting unit and thesecond light emitting unit; a circuit substrate electrically connectedto the first light emitting unit and the second light emitting unit tosupply a power source voltage to the first light emitting unit and thesecond light emitting unit; and wherein the second terminal makescontact with the first light emitting diode, the third terminal makescontact with the second light emitting diode, and the second terminalfaces the third terminal in an area between the first terminal and thefourth terminal, wherein the circuit substrate comprises: an insulationpart; a first conductive pattern disposed on the insulation part andelectrically connected to the first terminal; a second conductivepattern disposed on the insulation part and electrically connected tothe second terminal and the third terminal; and a third conductivepattern disposed on the insulation part and electrically connected tothe fourth terminal.
 21. A backlight light emitting package comprising:a first light emitting unit having first and second electrodes, athermally conductive area, and a first heat conduction member extendingfrom the thermally conductive area; a second light emitting unit havingfirst and second electrodes, a thermally conductive area, and a secondheat conduction member extending from the thermally conductive area ofthe second light emitting unit; and a heat connection member contactingthe first and second heat conduction members and configured to absorbheat generated by the first light emitting unit and the secondlight-emitting unit of the backlight emitting package.
 22. The backlightlight emitting package of claim 21, wherein the heat connection memberis not electrically connected to either the first light emitting unit orthe second light emitting unit.
 23. The backlight light emitting packageof claim 21, wherein the heat connection member is at least partiallyexposed on an exterior surface of the backlight emitting package todischarge the heat absorbed from the first light emitting unit and thesecond light emitting unit away from the backlight light emittingpackage.
 24. The backlight light emitting package of claim 21, whereinthe heat connection member is connected to a first light emittingelement of the first light emitting unit and a second light emittingelement of the second light emitting unit.
 25. The backlight lightemitting package of claim 21, wherein the heat connection member iselectrically connected to a first electrical conductive terminal of thefirst light emitting unit and to a first electrical conductive terminalof the second light emitting unit.
 26. The backlight light emittingpackage of claim 24, wherein the first heat conduction member contactsthe thermally conductive area and one of the electrodes of the firstlight emitting unit.
 27. The backlight light emitting package of claim26, wherein the second heat conduction member contacts the thermallyconductive area and one of the electrodes of the second light emittingunit.